Patent 7371637 was granted and assigned to Cypress Semiconductor Corporation on May, 2008 by the United States Patent and Trademark Office.
A method of making a semiconductor structure comprises forming an oxide layer on a substrate; forming a silicon nitride layer on the oxide layer; annealing the layers in NO; and annealing the layers in ammonia. The equivalent oxide thickness of the oxide layer and the silicon nitride layer together is at most 25 Angstroms.