Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 13, 2008
Patent Application Number
11056128
Date Filed
February 14, 2005
Patent Primary Examiner
Patent abstract
The flatness of the surface of a Si substrate is requested as the present gate length is miniaturized. The present invention is a semiconductor device fabrication method for flattening a silicon surface by continuously supplying a high-temperature fluoride ammonium solution to the surface a silicon substrate in which at least the silicon surface is locally exposed.
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