US Patent 7371694 Semiconductor device fabrication method and fabrication apparatus
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Patent abstract
The flatness of the surface of a Si substrate is requested as the present gate length is miniaturized. The present invention is a semiconductor device fabrication method for flattening a silicon surface by continuously supplying a high-temperature fluoride ammonium solution to the surface a silicon substrate in which at least the silicon surface is locally exposed.
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US Patent 07371694 Semiconductor device fabrication method and fabrication apparatus US Patent 7371694 Semiconductor device fabrication method and fabrication apparatus
Infobox
Patent Number
0737169400
Patent Number
737169400
Edits on 27 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073716940
Date of Patent
May 13, 2008
0Patent Application Number
110561280
Date Filed
February 14, 2005
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073716940
Date of Patent
May 13, 2008
0Patent Application Number
110561280
Date Filed
February 14, 2005
0Official Website
Patent Primary Examiner
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US Patent 07371694 Semiconductor device fabrication method and fabrication apparatus
Infobox
Is a
Patent jurisdiction
Patent number
07371694
Date of patent
May 13, 2008
Patent application number
11056128
Date Filed
February 14, 2005
Patent primary examiner
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