Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 20, 2008
Patent Application Number
11300445
Date Filed
December 15, 2005
Patent Primary Examiner
Patent abstract
A semiconductor sensor for improving manufacturing productivity. Opposing electrodes, or a diaphragm electrode and a fixed electrode, form an electrostatic capacity sensing semiconductor microphone on a microphone chip. A through electrode is formed on the microphone chip by a conductor extending between the upper and lower surfaces of the semiconductor substrate. The through electrode directly and electrically connects a MEMS configuration formed by the diaphragm electrode to the wiring of a printed wiring board without using wire bonding.
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