Patent 7373835 was granted and assigned to Sanyo on May, 2008 by the United States Patent and Trademark Office.
A semiconductor sensor for improving manufacturing productivity. Opposing electrodes, or a diaphragm electrode and a fixed electrode, form an electrostatic capacity sensing semiconductor microphone on a microphone chip. A through electrode is formed on the microphone chip by a conductor extending between the upper and lower surfaces of the semiconductor substrate. The through electrode directly and electrically connects a MEMS configuration formed by the diaphragm electrode to the wiring of a printed wiring board without using wire bonding.