Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 20, 2008
Patent Application Number
11257457
Date Filed
October 24, 2005
Patent Primary Examiner
Patent abstract
A semiconductor device including a semiconductor element, an electrode pad formed on the semiconductor element, and a bump electrode conductively connected to the electrode pad which includes a resin bump formed on an active face of the semiconductor element and a conductive layer provided from the electrode pad to the surface of the resin bump, the conductive layer and the resin bump being arranged without adhesion.
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