US Patent 7375427 Semiconductor device, circuit board, electro-optic device, electronic device
Patent 7375427 was granted and assigned to Seiko Epson on May, 2008 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor device including a semiconductor element, an electrode pad formed on the semiconductor element, and a bump electrode conductively connected to the electrode pad which includes a resin bump formed on an active face of the semiconductor element and a conductive layer provided from the electrode pad to the surface of the resin bump, the conductive layer and the resin bump being arranged without adhesion.
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US Patent 07375427 Semiconductor device, circuit board, electro-optic device, electronic device US Patent 7375427 Semiconductor device, circuit board, electro-optic device, electronic device
Infobox
Patent Number
0737542700
Patent Number
737542700
Edits on 26 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073754270
Date of Patent
May 20, 2008
0Patent Application Number
112574570
Date Filed
October 24, 2005
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073754270
Date of Patent
May 20, 2008
0Patent Application Number
112574570
Date Filed
October 24, 2005
0Official Website
Patent Primary Examiner
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US Patent 07375427 Semiconductor device, circuit board, electro-optic device, electronic device
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07375427
Date of patent
May 20, 2008
Patent application number
11257457
Date Filed
October 24, 2005
Patent primary examiner
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