Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masashi Miyazaki0
Tatsuro Sawatari0
Date of Patent
May 27, 2008
0Patent Application Number
111147810
Date Filed
April 25, 2005
0Patent Primary Examiner
Patent abstract
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.
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