US Patent 7379306 Multilayer substrate including components therein
Patent 7379306 was granted and assigned to Taiyo Yuden on May, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Masashi Miyazaki0
Tatsuro Sawatari0
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Article (+599 characters)
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Patent abstract
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.
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US Patent 07379306 Multilayer substrate including components therein US Patent 7379306 Multilayer substrate including components therein
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Patent Number
073793060
Patent Number
73793060
Edits on 20 May, 2023
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Official Website
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
073793060
Date of Patent
May 27, 2008
0Patent Application Number
111147810
Date Filed
April 25, 2005
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
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US Patent 07379306 Multilayer substrate including components therein
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07379306
Date of patent
May 27, 2008
Patent application number
11114781
Date Filed
April 25, 2005
Patent primary examiner
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