Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 3, 2008
Patent Application Number
11123328
Date Filed
May 6, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
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