Log in
Enquire now
‌

US Patent 11756911 Metal pad modification

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11756911
Patent Inventor Names
Krishna Tunga
Ekta Misra
Date of Patent
September 12, 2023
Patent Application Number
16438578
Date Filed
June 12, 2019
Patent Citations
‌
US Patent 9397059 Bonded structures for package and substrate
‌
US Patent 9881885 Metal routing architecture for integrated circuits
‌
US Patent 10090271 Metal pad modification
‌
US Patent 10373925 Metal pad modification
‌
US Patent 8026602 Fabrication method of semiconductor device having conductive bumps
‌
US Patent 8178967 Low fabrication cost, high performance, high reliability chip scale package
‌
US Patent 8298929 Offset solder vias, methods of manufacturing and design structures
‌
US Patent 9093440 Connector structures of integrated circuits
...
Patent Primary Examiner
‌
Jasmine J Clark
CPC Code
‌
H01L 2224/13186
‌
H01L 2224/13113
‌
H01L 2224/13116
‌
H01L 2224/13139
‌
H01L 2224/13147
‌
H01L 2224/05124
‌
H01L 2224/05147
‌
H01L 2224/05647
...

The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 11756911 Metal pad modification

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us