Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 28, 2015
0Patent Application Number
142606270
Date Filed
April 24, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.
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