US Patent 9093440 Connector structures of integrated circuits
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Patent abstract
A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.
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US Patent 09093440 Connector structures of integrated circuits US Patent 9093440 Connector structures of integrated circuits
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Patent Number
090934400
Patent Number
90934400
Edits on 25 May, 2023
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Official Website
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Patent Jurisdiction
Patent Number
090934400
Date of Patent
July 28, 2015
0Patent Application Number
142606270
Date Filed
April 24, 2014
0Official Website
Patent Primary Examiner
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US Patent 09093440 Connector structures of integrated circuits
Infobox
Is a
Patent jurisdiction
Patent number
09093440
Date of patent
July 28, 2015
Patent application number
14260627
Date Filed
April 24, 2014
Patent primary examiner
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