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US Patent 11756911 Metal pad modification

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
June 12, 2019
Date of Patent
September 12, 2023
Patent Application Number
16438578
Patent Citations
‌
US Patent 9397059 Bonded structures for package and substrate
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US Patent 9881885 Metal routing architecture for integrated circuits
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US Patent 10090271 Metal pad modification
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US Patent 10373925 Metal pad modification
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US Patent 8026602 Fabrication method of semiconductor device having conductive bumps
‌
US Patent 8178967 Low fabrication cost, high performance, high reliability chip scale package
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US Patent 8298929 Offset solder vias, methods of manufacturing and design structures
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US Patent 9093440 Connector structures of integrated circuits
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US Patent 9233835 Shaped and oriented solder joints
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US Patent 7095116 Aluminum-free under bump metallization structure
•••
Patent Inventor Names
Krishna Tunga
Ekta Misra
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11756911
Patent Primary Examiner
‌
Jasmine J Clark
CPC Code
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H01L 2224/13186
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H01L 2224/13113
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H01L 2224/13116
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H01L 2224/13139
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H01L 2224/13147
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H01L 2224/05124
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H01L 2224/05147
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H01L 2224/05647
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H01L 2224/05572
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H01L 2224/05144
•••

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