Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 19, 2016
Patent Application Number
14840811
Date Filed
August 31, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.
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