Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 17, 2008
Patent Application Number
11137048
Date Filed
May 25, 2005
Patent Primary Examiner
Patent abstract
A saw for dicing substrates, such as semiconductor wafers, that has one or more variable indexing capabilities and two or more blades. One of the blades may be moved laterally or vertically, independent of one or more other blades.
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