US Patent 7387119 Dicing saw with variable indexing capability
Patent 7387119 was granted and assigned to Micron Technology on June, 2008 by the United States Patent and Trademark Office.
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Patent abstract
A saw for dicing substrates, such as semiconductor wafers, that has one or more variable indexing capabilities and two or more blades. One of the blades may be moved laterally or vertically, independent of one or more other blades.
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US Patent 07387119 Dicing saw with variable indexing capability US Patent 7387119 Dicing saw with variable indexing capability
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Patent Number
0738711900
Patent Number
738711900
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073871190
Date of Patent
June 17, 2008
0Patent Application Number
111370480
Date Filed
May 25, 2005
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073871190
Date of Patent
June 17, 2008
0Patent Application Number
111370480
Date Filed
May 25, 2005
0Official Website
Patent Primary Examiner
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US Patent 07387119 Dicing saw with variable indexing capability
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07387119
Date of patent
June 17, 2008
Patent application number
11137048
Date Filed
May 25, 2005
Patent primary examiner
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