US Patent 7387964 Copper polishing cleaning solution
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Patent Inventor Names
Joseph K. So0
Terence M. Thomas0
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Patent abstract
A cleaning solution for removing copper complex residues from the surface of polishing pads and wafer substrates includes an amine pH-adjusting agent, which can be a unidentate or bidentate amine compound or a quartnary ammonium hydroxide compound or an amine including an alcohol group. The cleaning solution also includes an amino acid complexing agent and an inhibitor. In a preferred embodiment, the cleaning solution has a basic pH.
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US Patent 07387964 Copper polishing cleaning solution US Patent 7387964 Copper polishing cleaning solution
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Patent Number
073879640
Patent Number
73879640
Edits on 6 Apr, 2023
Golden AI
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Patent Jurisdiction
Patent Number
073879640
Date of Patent
June 17, 2008
0Patent Application Number
104548770
Date Filed
June 5, 2003
0Official Website
Patent Primary Examiner
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US Patent 07387964 Copper polishing cleaning solution
Infobox
Is a
Patent jurisdiction
Patent number
07387964
Date of patent
June 17, 2008
Patent application number
10454877
Date Filed
June 5, 2003
Patent primary examiner
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