Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 15, 2008
Patent Application Number
11147245
Date Filed
June 8, 2005
Patent Primary Examiner
Patent abstract
A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.
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