US Patent 7399682 Wafer processing method
Patent 7399682 was granted and assigned to Disco Corporation on July, 2008 by the United States Patent and Trademark Office.
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Patent abstract
A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.
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US Patent 07399682 Wafer processing method US Patent 7399682 Wafer processing method
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Patent Number
0739968200
Patent Number
739968200
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
073996820
Date of Patent
July 15, 2008
0Patent Application Number
111472450
Date Filed
June 8, 2005
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073996820
Date of Patent
July 15, 2008
0Patent Application Number
111472450
Date Filed
June 8, 2005
0Official Website
Patent Primary Examiner
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US Patent 07399682 Wafer processing method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07399682
Date of patent
July 15, 2008
Patent application number
11147245
Date Filed
June 8, 2005
Patent primary examiner
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