Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 22, 2008
Patent Application Number
10914361
Date Filed
August 9, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
A light emitting diode package and method of manufacturing the light emitting diode package are provided. The light emitting diode package includes a sub-mount portion and a frame portion extending from the sub-mount portion. The frame portion has angled walls and is configured to receive a light emitting diode therein.
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