US Patent 7408120 Printed circuit board having axially parallel via holes

Patent 7408120 was granted and assigned to Samsung on August, 2008 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Samsung

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7408120

Date of Patent

August 5, 2008

Patent Application Number

11042360

Date Filed

January 24, 2005

Patent Citations Received

‌

US Patent 12063735 Electronic substrate having differential coaxial vias

Patent Primary Examiner

‌

Tuan Dinh

Patent abstract

Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 7408120 Printed circuit board having axially parallel via holes

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API