US Patent 7408120 Printed circuit board having axially parallel via holes
Patent 7408120 was granted and assigned to Samsung on August, 2008 by the United States Patent and Trademark Office.
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Patent abstract
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole.
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US Patent 07408120 Printed circuit board having axially parallel via holes US Patent 7408120 Printed circuit board having axially parallel via holes
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Patent Number
0740812000
Patent Number
740812000
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Official Website
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
074081200
Date of Patent
August 5, 2008
0Patent Application Number
110423600
Date Filed
January 24, 2005
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
074081200
Date of Patent
August 5, 2008
0Patent Application Number
110423600
Date Filed
January 24, 2005
0Official Website
Patent Primary Examiner
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US Patent 07408120 Printed circuit board having axially parallel via holes
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07408120
Date of patent
August 5, 2008
Patent application number
11042360
Date Filed
January 24, 2005
Patent primary examiner
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