US Patent 7414324 Wafer structure with mirror shot
Patent 7414324 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on August, 2008 by the United States Patent and Trademark Office.
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Patent abstract
A wafer structure with mirror shot is provided. A wafer structure according to the present invention comprises a first mirror shot area to which a mirror shot is applied, wherein the position of a first die is searched for based on the first mirror shot area. The wafer structure further comprises a second mirror shot area to which the mirror shot is applied. The second mirror shot area is located diagonally with respect to the first mirror shot area.
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US Patent 07414324 Wafer structure with mirror shot US Patent 7414324 Wafer structure with mirror shot
Infobox
Patent Number
0741432400
Patent Number
741432400
Edits on 28 Apr, 2023
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Infobox
Is a
Current Assignee
0
Patent Jurisdiction
Patent Number
074143240
Date of Patent
August 19, 2008
0Patent Application Number
115431870
Date Filed
October 4, 2006
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
0
Patent Jurisdiction
Patent Number
074143240
Date of Patent
August 19, 2008
0Patent Application Number
115431870
Date Filed
October 4, 2006
0Official Website
Patent Primary Examiner
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US Patent 07414324 Wafer structure with mirror shot
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07414324
Date of patent
August 19, 2008
Patent application number
11543187
Date Filed
October 4, 2006
Patent primary examiner
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