US Patent 7416992 Method of patterning a low-k dielectric using a hard mask

Patent 7416992 was granted and assigned to Advanced Micro Devices on August, 2008 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Advanced Micro Devices

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7416992

Date of Patent

August 26, 2008

Patent Application Number

11287632

Date Filed

November 28, 2005

Patent Primary Examiner

‌

Michael S. Lebentritt

Patent abstract

By using a non-metallic hard mask for patterning low-k dielectric materials of advanced semiconductor devices, an enhanced degree of etch fidelity is obtained. The present invention may readily be applied to via first-trench last, trench first-via last schemes.

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