US Patent 7417307 System and method for direct-bonding of substrates
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Patent Inventor Names
Arthur Piehl0
Charles C Haluzak0
Chien-Hua Chen0
Jennifer Shih0
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Patent abstract
A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
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US Patent 07417307 System and method for direct-bonding of substrates US Patent 7417307 System and method for direct-bonding of substrates
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Patent Number
07417307
Patent Number
7417307
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US Patent 07417307 System and method for direct-bonding of substrates
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Is a
Patent jurisdiction
Patent number
07417307
Date of patent
August 26, 2008
Patent application number
11192377
Date Filed
July 29, 2005
Patent primary examiner
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