Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wei-Chang Tai0
Cheng-Yin Lee0
Chi-Chih Chu0
Meng-Jung Chuang0
Date of Patent
August 26, 2008
0Patent Application Number
114202300
Date Filed
May 25, 2006
0Patent Primary Examiner
Patent abstract
A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the periphery area and partially exposing the surface of the solder pads. The solder mask includes at least a void therein.
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