Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Youn Gon Park0
Ho Sung Choo0
Jong Myeon Lee0
Date of Patent
September 16, 2008
Patent Application Number
11708459
Date Filed
February 21, 2007
Patent Primary Examiner
Patent abstract
A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.
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