US Patent 7425731 Light emitting diode package

Patent 7425731 was granted and assigned to Samsung on September, 2008 by the United States Patent and Trademark Office.

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Patent Inventor Names

Ho Sung Choo0

Jong Myeon Lee0

Youn Gon Park0

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Patent abstract

A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.

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