Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tomoyuki Abe0
Shinya Iijima0
Date of Patent
September 30, 2008
0Patent Application Number
114835270
Date Filed
July 11, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having an increased hardness as compared with the inner part.
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