US Patent 7429796 Semiconductor device and fabrication process thereof
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Patent Inventor Names
Shinya Iijima0
Tomoyuki Abe0
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Patent abstract
A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having an increased hardness as compared with the inner part.
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US Patent 07429796 Semiconductor device and fabrication process thereof US Patent 7429796 Semiconductor device and fabrication process thereof
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Patent Number
074297960
Patent Number
74297960
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Patent Jurisdiction
Patent Number
074297960
Date of Patent
September 30, 2008
0Patent Application Number
114835270
Date Filed
July 11, 2006
0Official Website
Patent Primary Examiner
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US Patent 07429796 Semiconductor device and fabrication process thereof
Infobox
Is a
Patent jurisdiction
Patent number
07429796
Date of patent
September 30, 2008
Patent application number
11483527
Date Filed
July 11, 2006
Patent primary examiner
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