Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
John Tang0
Daoqiang Lu0
Date of Patent
October 14, 2008
Patent Application Number
11479835
Date Filed
June 30, 2006
Patent Primary Examiner
Patent abstract
An embodiment of the present invention is a technique to fabricate a package. A metal sheet having trenches is formed. A thinned wafer supported by a wafer support substrate (WSS) is formed. The metal sheet is bonded to the WSS-supported thinned wafer to form a metal bonded thinned wafer. The thinned wafer is diced to the trenches into die assemblies.
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