US Patent 7435664 Wafer-level bonding for mechanically reinforced ultra-thin die
Patent 7435664 was granted and assigned to Intel on October, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Daoqiang Lu0
John Tang0
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Patent abstract
An embodiment of the present invention is a technique to fabricate a package. A metal sheet having trenches is formed. A thinned wafer supported by a wafer support substrate (WSS) is formed. The metal sheet is bonded to the WSS-supported thinned wafer to form a metal bonded thinned wafer. The thinned wafer is diced to the trenches into die assemblies.
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US Patent 07435664 Wafer-level bonding for mechanically reinforced ultra-thin die US Patent 7435664 Wafer-level bonding for mechanically reinforced ultra-thin die
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Patent Number
07435664
Patent Number
7435664
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US Patent 07435664 Wafer-level bonding for mechanically reinforced ultra-thin die
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Is a
Current assignee
Patent jurisdiction
Patent number
07435664
Date of patent
October 14, 2008
Patent application number
11479835
Date Filed
June 30, 2006
Patent primary examiner
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