US Patent 7439617 Capillary underflow integral heat spreader

A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component.