Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Philip Lyndon Cablao0
Dario S. Filoteo, Jr.0
Emmanuel Espiritu0
Leo A. Merilo0
Date of Patent
October 21, 2008
0Patent Application Number
114625370
Date Filed
August 4, 2006
0Patent Primary Examiner
Patent abstract
An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.
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