US Patent 7439620 Integrated circuit package-in-package system
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Patent Inventor Names
Dario S. Filoteo, Jr.0
Emmanuel Espiritu0
Leo A. Merilo0
Philip Lyndon Cablao0
Edits on 15 Sep, 2023
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Patent abstract
An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.
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US Patent 07439620 Integrated circuit package-in-package system US Patent 7439620 Integrated circuit package-in-package system
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Patent Number
074396200
Patent Number
74396200
Edits on 23 May, 2023
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Official Website
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Patent Jurisdiction
Patent Number
074396200
Date of Patent
October 21, 2008
0Patent Application Number
114625370
Date Filed
August 4, 2006
0Official Website
Patent Primary Examiner
Edits on 14 Jun, 2022
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US Patent 07439620 Integrated circuit package-in-package system
Infobox
Is a
Patent jurisdiction
Patent number
07439620
Date of patent
October 21, 2008
Patent application number
11462537
Date Filed
August 4, 2006
Patent primary examiner
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