US Patent 7446034 Process for making a metal seed layer
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Patent abstract
An exemplary method includes: providing a substrate with an exposed metal surface, performing a reducing process on the metal surface, and transferring the substrate in an inert or reducing ambient to a chamber for that is used for metal layer deposition.
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US Patent 07446034 Process for making a metal seed layer US Patent 7446034 Process for making a metal seed layer
Infobox
Patent Number
0744603400
Patent Number
744603400
Edits on 5 Apr, 2023
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Patent Jurisdiction
Patent Number
074460340
Date of Patent
November 4, 2008
0Patent Application Number
114268220
Date Filed
June 27, 2006
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
074460340
Date of Patent
November 4, 2008
0Patent Application Number
114268220
Date Filed
June 27, 2006
0Official Website
Patent Primary Examiner
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US Patent 07446034 Process for making a metal seed layer
Infobox
Is a
Patent jurisdiction
Patent number
07446034
Date of patent
November 4, 2008
Patent application number
11426822
Date Filed
June 27, 2006
Patent primary examiner
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