US Patent 7463466 Integrated circuit with ESD protection circuit
Patent 7463466 was granted and assigned to United Microelectronics Corporation on December, 2008 by the United States Patent and Trademark Office.
All edits
An integrated circuit (IC) having an electrostatic discharge (ESD) protection circuit therein is provided. The IC comprises a plurality of bonding pads, a plurality of ESD units, a first ESD bus and a second ESD bus. The first ESD bus has no direct connection with any power pad of the IC. Each ESD unit comprises a first diode, a second diode and an ESD clamping device. Due to the one-to-one correspondent of each bonding pad with an ESD unit, the present invention ensures ESD continuity through a continuous charge dissipation path no matter what kind of pin-to-pin ESD test the IC is undergoing or how many power sources the IC has. In addition, a bonding pad over active circuitry (BOAC) structure can also be deployed in the present invention to provide a better ESD protection for the whole IC chip.
US Patent 07463466 Integrated circuit with ESD protection circuit US Patent 7463466 Integrated circuit with ESD protection circuit
US Patent 07463466 Integrated circuit with ESD protection circuit
Find more entities like US Patent 7463466 Integrated circuit with ESD protection circuit
