Patent 7468326 was granted and assigned to United Microelectronics Corporation on December, 2008 by the United States Patent and Trademark Office.
A wafer is provided and loaded in a reaction chamber. Subsequently, the wafer is lifted up, and a dry clean process is performed on the wafer to clean the front side, the back side, and the bevel of the wafer. Following that, a deposition process is performed on the wafer. The dry clean process and the deposition process are carried out in an in-situ manner.