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US Patent 7488235 Polishing apparatus and related polishing methods

Patent 7488235 was granted and assigned to Samsung on February, 2009 by the United States Patent and Trademark Office.

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Patent abstract

Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.

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