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US Patent 7488235 Polishing apparatus and related polishing methods

Patent 7488235 was granted and assigned to Samsung on February, 2009 by the United States Patent and Trademark Office.

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Patent Inventor Names
Hong-Seong Son0
Ja-Hyung Han0
Jong-Gyoon Kim0
Moo-Yong Park0
Sang-Rok Hah0
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Patent abstract

Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.

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Patent Citations Received
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US Patent 11691241 Abrasive lapping head with floating and rigid workpiece carrier
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edited on 21 May, 2023
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US Patent 07488235 Polishing apparatus and related polishing methods US Patent 7488235 Polishing apparatus and related polishing methods

Infobox
Patent Number
074882350
Patent Number
74882350
Edits on 18 May, 2023
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edited on 18 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=074882350
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Infobox
Is a
Patent
Patent
0
Current Assignee
Samsung
Samsung
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
074882350
Date of Patent
February 10, 2009
0
Patent Application Number
113814150
Date Filed
May 3, 2006
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=074882350
Patent Primary Examiner
‌
Eileen P. Morgan
0
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"Entity importer update"
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edited on 14 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07488235
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 US Patent 07488235 Polishing apparatus and related polishing methods

Infobox
Is a
Patent
Patent
Current assignee
Samsung
Samsung
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07488235
Date of patent
February 10, 2009
Patent application number
11381415
Date Filed
May 3, 2006
Patent primary examiner
‌
Eileen P. Morgan

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