Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 24, 2009
Patent Application Number
11744446
Date Filed
May 4, 2007
Patent Primary Examiner
Patent abstract
A copper film is treated by applying light at short wavelengths, e.g., at less than 0.6 μm, to heat the copper film and generate a large temperature gradient from the surface of the copper to the interface between the copper and underlying silicon. As a result, grain growth in the copper is enhanced.
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