Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shaun Pendo0
Edward Chernoff0
Rajiv Shah0
Date of Patent
April 7, 2009
0Patent Application Number
108619760
Date Filed
June 4, 2004
0Patent Primary Examiner
Patent abstract
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
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