US Patent 7514038 Sensor substrate and method of fabricating same
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Patent Inventor Names
Edward Chernoff0
Rajiv Shah0
Shaun Pendo0
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Patent abstract
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
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US Patent 07514038 Sensor substrate and method of fabricating same US Patent 7514038 Sensor substrate and method of fabricating same
Infobox
Patent Number
075140380
Patent Number
75140380
Edits on 25 Sep, 2022
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Patent Jurisdiction
Patent Number
075140380
Date of Patent
April 7, 2009
0Patent Application Number
108619760
Date Filed
June 4, 2004
0Official Website
Patent Primary Examiner
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US Patent 07514038 Sensor substrate and method of fabricating same
Infobox
Is a
Patent jurisdiction
Patent number
07514038
Date of patent
April 7, 2009
Patent application number
10861976
Date Filed
June 4, 2004
Patent primary examiner
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