US Patent 7524430 Fluid ejection device structures and methods therefor
Patent 7524430 was granted and assigned to Lexmark International, Inc. on April, 2009 by the United States Patent and Trademark Office.
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Patent Inventor Names
Andrew L. McNees0
John W. Krawczyk0
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Patent abstract
Methods of forming a fluid channel in a semiconductor substrate may include applying a material layer to at least one surface of the semiconductor substrate. The method may further include manipulating the material layer to form a surface topography corresponding to a channel, the surface topography being configured to control directionality of ion bombardment of said substrate along electromagnetic field lines in a plasma sheath coupled to said surface topography.
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US Patent 07524430 Fluid ejection device structures and methods therefor US Patent 7524430 Fluid ejection device structures and methods therefor
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Patent Number
075244300
Patent Number
75244300
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Current Assignee
Patent Jurisdiction
Patent Number
075244300
Date of Patent
April 28, 2009
0Patent Application Number
110268390
Date Filed
December 30, 2004
0Official Website
Patent Primary Examiner
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US Patent 07524430 Fluid ejection device structures and methods therefor
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07524430
Date of patent
April 28, 2009
Patent application number
11026839
Date Filed
December 30, 2004
Patent primary examiner
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