Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Olli Salmela0
Ilpo Kokkonen0
Date of Patent
May 12, 2009
0Patent Application Number
111555720
Date Filed
June 20, 2005
0Patent Primary Examiner
Patent abstract
The idea of the invention is to form a cavity in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates, such as printed circuit boards, modules, and sub-systems. Trimming is done through the cavity using, for example, a laser. After trimming the cavity is easy to fill in with a suitable dielectric material, or to cover otherwise, e.g. by using a lid, or to leave the cavity uncovered.
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