Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kazuaki Kojima0
Date of Patent
May 19, 2009
0Patent Application Number
117991800
Date Filed
May 1, 2007
0Patent Primary Examiner
Patent abstract
A semiconductor device includes a semiconductor chip having at least an electrode pad and a device formed on a semiconductor layer on its surface, a seal cap having a recess portion facing the device which is adhered to the surface of the semiconductor chip, and a cavity as an airspace formed by the recess portion between the semiconductor chip and the seal cap. The semiconductor chip includes a stepped portion at a portion of the back surface opposite the surface to have an uneven thickness.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.