US Patent 7535097 Semiconductor device and method of manufacturing the same
Patent 7535097 was granted and assigned to Olympus Group on May, 2009 by the United States Patent and Trademark Office.
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Patent Inventor Names
Kazuaki Kojima0
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Patent abstract
A semiconductor device includes a semiconductor chip having at least an electrode pad and a device formed on a semiconductor layer on its surface, a seal cap having a recess portion facing the device which is adhered to the surface of the semiconductor chip, and a cavity as an airspace formed by the recess portion between the semiconductor chip and the seal cap. The semiconductor chip includes a stepped portion at a portion of the back surface opposite the surface to have an uneven thickness.
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US Patent 07535097 Semiconductor device and method of manufacturing the same US Patent 7535097 Semiconductor device and method of manufacturing the same
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Patent Number
075350970
Patent Number
75350970
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Current Assignee
Patent Jurisdiction
Patent Number
075350970
Date of Patent
May 19, 2009
0Patent Application Number
117991800
Date Filed
May 1, 2007
0Official Website
Patent Primary Examiner
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US Patent 07535097 Semiconductor device and method of manufacturing the same
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07535097
Date of patent
May 19, 2009
Patent application number
11799180
Date Filed
May 1, 2007
Patent primary examiner
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