US Patent 7547636 Pulsed ultra-high aspect ratio dielectric etch
Patent 7547636 was granted and assigned to Lam Research on June, 2009 by the United States Patent and Trademark Office.
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Patent abstract
A method for selectively etching an ultra high aspect ratio feature dielectric layer through a carbon based mask in an etch chamber is provided. A flow of an etch gas is provided, comprising a fluorocarbon containing molecule and an oxygen containing molecule to the etch chamber. A pulsed bias RF signal is provided. An energizing RF signal is provided to transform the etch gas to a plasma.
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Current Assignee
Patent Jurisdiction
Patent Number
75476360
Date of Patent
June 16, 2009
0Patent Application Number
116713420
Date Filed
February 5, 2007
0Patent Primary Examiner
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Official Website
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US Patent 07547636 Pulsed ultra-high aspect ratio dielectric etch US Patent 7547636 Pulsed ultra-high aspect ratio dielectric etch
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Patent Number
0754763600
Patent Number
754763600
Edits on 21 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075476360
Date of Patent
June 16, 2009
0Patent Application Number
116713420
Date Filed
February 5, 2007
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075476360
Date of Patent
June 16, 2009
0Patent Application Number
116713420
Date Filed
February 5, 2007
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
Golden AI
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US Patent 07547636 Pulsed ultra-high aspect ratio dielectric etch
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07547636
Date of patent
June 16, 2009
Patent application number
11671342
Date Filed
February 5, 2007
Patent primary examiner
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