Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 23, 2009
Patent Application Number
11424202
Date Filed
June 14, 2006
Patent Primary Examiner
Patent abstract
A package-on-package system is provided with a base package. Solder caps are provided on the top of the base package. The solder caps are configured to protrude above subsequent resin bleed, and are configured for merging with solder balls of a top package to form larger solder balls between such a top package and the base package.
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